VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements. Designed for measurement of parts and assemblies with complex dimensions and a high density of features. They include the most advanced QVI technologies for high accuracy, repeatability, and throughput. No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution.
VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.