English 
简体中文 
繁體中文 
한국어 
ไทย 
Tiếng Việt 
日本語 
No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution. VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.
Connector Measurement
Quickly acquire data on connector positions, size, pitch, & coplanarity measurements
Electronic Assembly Calibration & Monitoring
Measurement of positioning and rotation (X, Y, and Theta) relative to pads
Measuring ball, tooling mark diameters, placement, pad alignment, & wire loop height
Hard Disc Drive Component Metrology
Mobile Phone, Tablet & Wearable Assembly
Accurate and efficient non-contact inspection of fan-out wafer-level packaging with multiple levels of magnification
Coplanarity, lead width, pitch, ball diameter, package height and warpage inspection
PCB Inspection
Measurement of critical features such as the positions of leads, pads, and warpage
Flexibility to rapidly measure a wide variety of aperture sizes, shapes, and positions
Photolithography & MEMs Fabrication
VIEW system analyzes the pixels within the measurement window and builds a radial intensity profile of the circle
Measurement of pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations
Flexibility to rapidly measure a wide variety of aperture sizes, shapes, and positions
Precision Micro-Grinding
Metrology system high-resolution stage motion, quality optics, autofocus capabilities
Inspection of electrical test probes requires precision metrology capabilities to accurately measure small features
Custom Engineering
Application-specific fixturing, programming, interfaces to third party sensors & equipment
