Optical Metrology Applications
Not sure which product is best for you?
No matter what the requirement for ultra high-precision measurement, VIEW has the ideal solution. VIEW non-contact measurement systems utilize sub-pixel image feature detection with either field-of-view (FOV) or point-to-point (PTP) configurations for exceptional accuracy and repeatability. From etch-dimensions on hard disk drive (HDD) heads to semiconductor overlay measurements, we provide the accuracy you need for quality manufacturing.
Measurement of positioning and rotation (X, Y, and Theta) relative to pads
Measurement of critical features such as the positions of leads, pads, and warpage
Micro-Elecro-Mechanical Systems (MEMS) Measurement
Measuring the true position and pitch of each lead within large multi-lead arrays
Quickly acquire data on connector positions, size, pitch, & coplanarity measurements
Precision Assembly & Fabrication
Fast measurement cycle times, sophisticated image recognition, flexible lighting capabilities
accurately inspecting critical factors such as bump height, location, and coplanarity often requires advanced metrology features
Non-contact measurement on chip carriers requires advanced lighting techniques and image processing capabilities
VIEW system analyzes the pixels within the measurement window and builds a radial intensity profile of the circle
Accurate and efficient non-contact inspection of flip chips with multiple levels of magnification