Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and coplanarity.

Accurate and efficient non-contact inspection of flip chips often requires advanced features such as multiple levels of magnification, Programmable Ring Light (PRL), and integrated lasers to improve inspection throughput rates.


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