VIA METROLOGY

Through-Silicon Vias (TSVs) and Through-Glass Vias (TGVs) used in advanced packaging, 3D ICs, HBM, and heterogeneous integration require inspection and metrology techniques for via geometry, etch depth, liner integrity, copper fill quality, void detection, defect classification, RDL alignments, and more. As via dimensions continue to shrink and heterogeneous integration expands, VIEW’s advanced 3D metrology and inspection capabilities provide high-speed, high-accuracy process control solutions.