RDL Layer Inspection

Redistribution Layer inspection involves examining the fine metal interconnects in advanced chip packages for defects and critical dimensions such as line width and thickness. 

VIEW systems measure critical dimensions, such as the width and spacing of the RDL traces (line and space), and the height of features like bumps.  Finding defects such as shorts, cuts, and opens in the RDL traces ensures the viability of high-performance chip packages by verifying the RDLs are correctly formed and free from flaws that could cause electrical failures.