Probe cards are electromechanical interfaces used in semiconductor manufacturing that connect to a wafer’s circuits with a variety of contact probes. By testing the electrical viability of each individual chip before it is diced and packaged, chip manufacturers can identify electrical defects early.
Dimensional metrology is needed on probe cards to measure key physical characteristics such as probe tip height uniformity, lateral position, and outer diameter. VIEW’s non-contact optical metrology systems can be used to measure tip positions and planarity, shapes, diameters, and pitches, as well as to perform reliable defect detection associated with wear, damaged, or missing probes.
