English 
简体中文 
繁體中文 
한국어 
ไทย 
Tiếng Việt 
日本語 
Large area, high-accuracy dimensional metrology systems.
The VIEW Summit systems are designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in the VIEW Pinnacle, the Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.
Available in three ranges of travel, the VIEW Summit is ideally suited for measurement of large footprint parts, such as PCBs, stencils, flat panel displays, etching sheets and mark patterns, or nested groups of smaller parts. The Summit provides very high accuracy and high speed for shop floor process monitoring and quality assurance applications.
Standard
Optional
XYZ Travel
Model 600 / 450x600x150 mm
Model 625 / 615x610x150 mm
Model 800 / 800x820x150 mm
Load Capacity
Model 600 / 50 kg
Model 625 / 50 kg
Model 800 / 75 kg
Imaging Optics
Metrology Camera
Illumination
Sensor Options
Through-the-lens (TTL) laser
Rainbow Probe ™ off-axis white light range sensor
Measurement Modes
FEATURES
The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.
Summit models can be equipped with an optional through-the-lens or offset mounted laser for added flexibility in Z-axis measurements. Summit models can also utilize the optional SpectraProbe™ offering sub-micron Z-axis measurement resolution.
Summit models operate with one or more of VIEW’s standard metrology software packages:
