English 
简体中文 
繁體中文 
한국어 
ไทย 
Tiếng Việt 
日本語 
Benchmark 300
High-value, high-accuracy dimensional metrology system
The VIEW Benchmark™ 300 delivers VIEW performance with a large measuring envelope, dual magnification optics, and metrology-grade construction.
Capable of measuring 300mm wafers with high precision, this rugged floor model configuration provides maximum mechanical integrity and accuracy in the stage motion.
Standard
Optional
XYZ Travel
300 x 300 x 200 mm
300 x 600 x 200 mm
Load Capacity
30 kg
Imaging Optics
Single magnification, fixed lens optics with factory configurable back tube and field interchangeable front lens
Dual magnification, fixed lens optics with field interchangeable front lens
Metrology Camera
2.0 megapixel (1628 x 1236), digital, monochrome metrology camera
Color and other camera configurations are optionally available
Illumination
Programmable LED illumination system for coaxial through-the-lens surface light, below-the-stage backlight, and multi-color ring light with motorized incidence angle control
Grid Autofocus System
Sensor Options
Through-the-Lens (TTL) laser Rainbow ProbeTM off-axis white light range sensor
Measurement Modes
High Speed Move and Measure (MAM)
Continuous Image Capture (CIC)
FEATURES
Dual magnification optics and an optional through-the-lens (TTL) laser sensor make the Benchmark an ideal system for many applications including molded plastic parts, screen printer stencils, printed circuit boards, solder paste, epoxy glue dots, precision machined parts, and many others.
The Benchmark 300 operates with any of VIEW’s standard metrology software packages:
