Bump on Die
Bump on die inspection presents some of the most demanding non-contact metrology challenges in today’s semiconductor manufacturing environments. The requirement to inspect very small part features while maintaining extremely tight tolerances is difficult under the best of circumstances.
However, the need to maintain high throughput to rapidly inspect samples from large volume production can make it even more challenging. With ball diameters as small as 3mil to 12mil, accurately inspecting critical factors such as bump height, location, and coplanarity often requires advanced metrology features, such as very high-resolution stage motion, dual magnification optics, and through-the-lens laser probe options.