Wire Bonding

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop height.

(800) SOS-VIEW(767-8439)


For system support status, please refer to:

Product Support Matrix

Application Study Performed on Your Parts

For a NO COST high-performance dimensional measurement systems application study